11th Gen Intel Tiger Lake Fanless Compact System
RISC-based DIN-rail Fanless Embedded System with i.MX 6UL Processor;1 COM; 1 LAN; DIO (4-in/4-out); and CANBus
Fanless Embedded System with i.MX 8M Processor;COM; LAN; USB; DIO (2-in/2-out); IsolatedCANBus; 2 PCIe MiniCard Slots; Power Design with ACC Ignition; and E-MarkCertification for Vehicle Box PC
Fanless boxComputer; Freescale i.MX6 1.0 GHz; RAM 1 GB;Card eMMC 4 GB; 1x HDMI; 2x USB 2.0; 1x miniUSB; 1xCOM; supply 12-26 V DC; oper. temperature -40+70C
BOX System with Rockchip RK3288
Fanless Embedded System with Intel Celeron J6413, up to 32GB DDR4 RAM, M.2, HDMI, DP, 2x LAN, 3x USB 3.0, USB 2.0, 4x COM, power supply 12-30V DC, oper. temp. -20...+60C,
BoxComputer; VIA Eden X2 1.0GHz; up to 4GB RAM; SATA; SD slot; 5x USB; HDMI; VGA; LAN; supply 12 V; operating temperature: 0+45C
BoxComputer; VIA Eden X4 1.2GHz; up to 8GB RAM; SATA; 4x USB; mini HDMI; VGA; LAN; supply 12 V; operating temperature: 0+40C
BoxComputer; VIA QuadCore E 1.0GHz; up to 8GB RAM; SATA; mSATA; 4x USB;COM; DIO; 2x HDMI; VGA; LAN; mPCIe; SIM slot; supply 12 V; operating temperature: 0+45C
BoxComputer; VIACortex A9 800MHz; 1GB RAM; 4GB eMMC; Micro SD slot; 2x USB;COM; 4x RS-485; DIO; mini HDMI; LAN; supply 12-24 V; operating temperature: -5+50C
BoxComputer; VIACortex A9 1GHz dual-core; 1GB RAM; 4GB eMMC; Micro SD slot; 2x USB; micro USB OTG;COM; DIO; GPIO; HDMI; LAN; miniPCIe supply 12 V; operating temperature: 0+50C
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