MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, black soldermask, legend color: gold, size: square 35mm, pad cover: gold; /20
MCPCB, thermal conductivity 2W/(m*K), thickness: 2mm, number of layers - 1, copper layer thickness 35um, black soldermask, legend color: gold, size: 22mm star, pad cover: gold; for XB-D LEDs, /24
Open Frame PanelComputer 19"; Intel Atom D2550 1.86 GHz; 4xCOM; 1x LAN; 4x USB 2.0; supply 12-24 V
IC Socket in pitch 2.54mm; 28-contacts; standard
PCB terminal block; pitch 5.0mm; 3-ways; vertical; wire range 1.5mm2 (AWG 22-14); rising clamp type; with screws for a flat screwdriver; brass cage; green color; UL 300V/10A, TUV 250V/16A
Telecom-splice; for cable-to-cable; cond. from D=0.4 mm to D=0.7 mm; insul. D=1.52 mm.
ZIF connector for FFC/FPC; pitch 0.50mm; 30-contacts; SMD; side entry; downside contacts
Chip Resistor; SMD; 0603; 150K; 5%; 1/10W
Chip Resistor; SMD; 0603; 1R5; 5%; 1/10W
Ceramic capacitor SMD; 0805; 0.22uF; 50V; Y5V; 20%
LED Driver; AC/DC converter; CH:1; 66kHz; 3-40W; PWM/DC dimming; external MOSFET transistor; 90-264V; -65+150 deg.C; SMD; SO8
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