Adp. board NL668-EAU-00
Fibocom G510-Q50-50-00, 2G module, GSM/GPRS, (850/900/1800/1900MHz), Audio x2,GPIO, SIM, UART x2;
Fibocom G510-Q50-50-00, 2G module, GSM/GPRS, (850/900/1800/1900MHz), Audio x2,GPIO, SIM, UART x2;
Fibocom G510-Q50-50-00, 2G module, GSM/GPRS, (850/900/1800/1900MHz), Audio x2,GPIO, SIM, UART x2;
Fibocom G510-Q50-50-90 OpenCPU, 2G module, GSM/GPRS, (850/900/1800/1900MHz), Audio x2,GPIO, SIM, UART x2;
Fibocom H330S-A30-20, 3G module, HSDPA (7.2Mbps)/HSUPA(5.76Mbps), 900/1800MHz, Data only, LGA120, 33.8 x 27.8 x 2.45mm, Chipset Intel, Supply 3.3...4.2V, Low current 2mA (Sleep Mode), Rx Sensitivity UMTS/HSPA -109dBm / GSM -107dBm
Fibocom 3G module, HSDPA(7.2Mbps)/HSUPA(5.76Mbps) , 900/1800/2100MHz, Data nad Voice (digital) transmis., LGA110 package, small size 29.8 x17.8 x 2.0 mm, weight 2.5g, Chipset Intel, 2mA (Sleep Mode), Sensitivity -109dBm/-108dBm, Interface USB/UART
Fibocom H350 A50-003G, UMTS/HSPA+/GSM module, (900/2100MHz), ADC, Audio x2, GPIO, SIM, SPI, UARTx2, USB, LGA110, Intel chipset
3G Module, UMTS/HSPA+/HSUPA/HSDPA/GSM, Fibocom H350 A50-00 (900/1800)MHz, ADC, Audio x2, GPIO, SIM, SPI, UARTx2, USB, SMD LGA110 pin, rev. V3H.00.16
3G Module, UMTS/HSPA+/HSUPA/HSDPA/GSM, Fibocom H350 A50-00 (900/1800)MHz, ADC, Audio x2, GPIO, SIM, SPI, UARTx2, USB, SMD LGA110 pin, rev. V3H.00.16
Fibocom L810-GL, 4G, LTE/UMTS/GSM module, USB 2.0, UART, I2C, I2S, GPIO, RTC, A/D, Digital Audio, LGA
Fibocom L830-GL, 4G, LTE/UMTS/GSM module, USB 2.0, UART, I2C, I2S, GPIO, RTC, A/D, Digital Audio, M.2
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